| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat releasing type adhesive sheet for electronic components which easily, with less contamination, peels from an electronic component in a heating process. SOLUTION: The heat releasing type adhesive sheet for electronic components comprises a thermal expansion layer that contains micro balls of thermal expansion property, and a non thermal expansion adhesive layer formed at least on one surface of the thermal expansion layer. The surface of the non thermal expansion adhesive layer is pasted to the surface of a silicon wafer, which is heated and released. The carbon element ratio R<SB>C1</SB>(%) on the surface of the silicon wafer satisfies at least either relational expression (1) : R<SB>C1</SB>≤50+R<SB>C2</SB>(1), or relational expression (2) : R<SB>C1</SB>≤2.5R<SB>Si</SB>(2), wherein R<SB>C2</SB>represents a carbon element ratio (%) on the surface of the silicon wafer before being pasted, and R<SB>Si</SB>represents a silicon element ratio (%) on the surface of the silicon wafer after the surface of the non thermal expansion adhesive layer is pasted to the surface of the silicon wafer, heated, and released. COPYRIGHT: (C)2005,JPO&NCIPI |
