METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device by which first and second conductive films are surely connected electrically to each other through a contact hole formed in an insulating film, and the manufacturing cost of a semiconductor device is reduced by far improving the utilizing efficiency of a liquid material required for the formation of the second conductive film. SOLUTION: The method of manufacturing the semiconductor device includes: an insulating film forming step ST0 of forming the insulating film on the first conductive film and, at the same time, the contact hole through the insulating film; a mask material forming step ST1 of forming a mask material which is opened in an area on the insulating film including the contact hole; a liquid material arranging step ST2 of selectively arranging the liquid material in an area on the insulating film including the contact hole through the opening of the mask material; a drying step ST3 of forming the second conductive film partially embedded in the contact hole by drying and solidifying the liquid material; and a mask material removing step ST4. COPYRIGHT: (C)2005,JPO&NCIPI