| 摘要 |
PROBLEM TO BE SOLVED: To achieve connection with high conductive reliability without causing crack in an ITO electrode formed on a resin film substrate even in a case where an anisotropic conductive adhesive is applied to opposing resin film substrates of a liquid crystal panel. SOLUTION: In the anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive ingredient, melt viscosity of the anisotropic conductive adhesive is not more than 60,000 poise during hot pressure bonding, and compression strength of the conductive particle is not more than 15 kgf/mm<SP>2</SP>at 10% deformation of compression. COPYRIGHT: (C)2005,JPO&NCIPI
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