| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for housing an electronic part which bonds rigidly a cover to a metal frame, is reduced in a profile size of an insulating substrate, and has excellent airtight sealing reliability, a small size and high reliability, and also to provide an electronic device. <P>SOLUTION: The package for housing the electronic part includes the insulating substrate 1 having a loading part 1a of the electronic part formed on an upper surface, and the metal frame 2 connected to surround the loading part 1a on an outer periphery of the upper surface of the insulating substrate 1. The metal frame 2 is formed of a collar part 2a at an upper end over the entire periphery. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
