| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a reliability by preventing the peeling of a semiconductor board regarding a semiconductor device and a manufacturing method for the semiconductor device, the circuit board and electronic equipment. <P>SOLUTION: The semiconductor device has a first board 20, a second board 30 overlapped with the board 20, and the semiconductor board 10 interposed between the board 20 and the board 30. The board 20 and the board 30 are bonded mutually in the peripheral region of the semiconductor board 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
