发明名称 POLYMER COMPOUND, RESIST MATERIAL, AND PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a polymer compound useful as a base resin for a resist material that is high in resolution, little in roughening of pattern side wall, has etching resistance of practical level, and has an enough latitude in temperature range for heat treatment after exposure. <P>SOLUTION: The polymer compound having an average molecular weight of 1,000 to 50,000, formed by containing one kind or more kinds of repeated units represented by the following general formulae(1) to (3), respectively, the resist material formed by containing the polymer compound, and a pattern forming method including a process for applying the resist material onto a substrate, a process for heat-treating the obtained film, a process for exposing the heat-treated film with a high energy ray or electron beam via a photomask, a process for heat-treating it after the exposure, and a process for developing it with a developing solution thereafter, are provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005097533(A) 申请公布日期 2005.04.14
申请号 JP20040144569 申请日期 2004.05.14
申请人 SHIN ETSU CHEM CO LTD 发明人 FUNATSU AKIYUKI;NISHI TSUNEHIRO;NAGURA SHIGEHIRO
分类号 C08F220/26;C08F220/28;G03C1/76;G03F7/039;H01L21/027 主分类号 C08F220/26
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