| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device wherein a manufacturing process can be simplified. <P>SOLUTION: The semiconductor device 50 consists of an insulating film 6 which consists of single material (SiO<SB>2</SB>) and is formed so as to be in contact with an upper surface of a semiconductor chip 5 containing a circuit; an extension pad 13 which is formed so as to be in contact with the upper surface of the insulating film 6; and of a wiring 16 which is formed so as to extend from the side surface of the semiconductor chip 5 along a lower surface, and connected to a lower surface of the extension pad 13 which is exposed by eliminating a part of the insulating film 6. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
| 申请公布号 |
JP2005101144(A) |
申请公布日期 |
2005.04.14 |
| 申请号 |
JP20030331142 |
申请日期 |
2003.09.24 |
| 申请人 |
SANYO ELECTRIC CO LTD |
发明人 |
KAIDA TAKAYUKI;SHIMIZU TATSU;OKIKAWA MITSURU;MIWA TETSUYA;NOMA TAKASHI |
| 分类号 |
H01L23/52;H01L21/3205;H01L21/60;H01L21/768;H01L23/12;H01L23/31;H01L23/485;(IPC1-7):H01L21/320 |
主分类号 |
H01L23/52 |
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