| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device that reduces man-hours when the device is reassembled without lowering the strength of an enclosure in a height direction. SOLUTION: Top boards 71, 81, and 91 are provided in the upper part of an enclosure 72, and an electrical section 70 is provided above the top board 71. A plurality of hinges 75 are attached to the projecting sections 71a of the top board 71 and the top board 71 and the upper part of the enclosure 72 are connected to each other through the hinges 75. Therefore, when the top board 81 is removed and the top board 71 is rotated around a rotation axis A5, the electrical section 70 is housed in a vacant area 85 formed above a main transporting area 38. COPYRIGHT: (C)2005,JPO&NCIPI
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