| 摘要 |
A method of manufacturing a plurality of beam-shapers (16) on a wafer of photodiode chips (14) comprises laying strips (48,50) for forming the beam-shapers across the width of the wafer and subsequently separating individual photodiode units by dividing the beam-shaper strips (48,50) into separate beam-shapers (16) located on individual photodiode chips (14). One embodiment uses internal reflection in a prism element to reduce a build height of the beam-shaper (16). |
