发明名称 LED and its manufacturing process
摘要 A LED manufacturing process includes multiple compounding potting procedures to form a fluorescent layer between a first resin layer and a second resin layer, keeping the chip and the electrode wire embedded with a part of the frame in the second resin layer and spaced from the fluorescent layer at a distance.
申请公布号 US2005077535(A1) 申请公布日期 2005.04.14
申请号 US20030680092 申请日期 2003.10.08
申请人 JOINSCAN ELECTRONICS CO., LTD 发明人 LI JUI-TUAN
分类号 H01J1/62;H01L29/22;H01L33/50;H01L33/52;(IPC1-7):H01L29/22 主分类号 H01J1/62
代理机构 代理人
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