发明名称 |
LED and its manufacturing process |
摘要 |
A LED manufacturing process includes multiple compounding potting procedures to form a fluorescent layer between a first resin layer and a second resin layer, keeping the chip and the electrode wire embedded with a part of the frame in the second resin layer and spaced from the fluorescent layer at a distance.
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申请公布号 |
US2005077535(A1) |
申请公布日期 |
2005.04.14 |
申请号 |
US20030680092 |
申请日期 |
2003.10.08 |
申请人 |
JOINSCAN ELECTRONICS CO., LTD |
发明人 |
LI JUI-TUAN |
分类号 |
H01J1/62;H01L29/22;H01L33/50;H01L33/52;(IPC1-7):H01L29/22 |
主分类号 |
H01J1/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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