| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the peeling of joined portions between an electrode pad and a stud bump and between the stud bump and an inner lead even if external stress caused by a difference of a thermal expansion coefficient is exerted on the joined portions, and to improve reliability. <P>SOLUTION: A through-hole 9 or a recessed slot penetrating the inner lead 5 is formed in a region ranging from the rear of the joined area of the inner lead 5 to near the opening side end face of a device hole 6 of a base film 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
