| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a land pattern which enables various kinds of semiconductor devices to be selectively mounted on the same printed board in a space-saving manner. <P>SOLUTION: ICs 1 and 2 which are selectively mounted on a printed board are equipped with pins that are arranged on their side edges at the same pitch and different from each other in size (different in width and length). Common lands 41, 41, etc are arranged corresponding to connection pins 12 and 22 provided to the one side edges of the ICs 1 and 2. By this setup, the ICs 1 and 2 of various kinds can be selectively mounted on the printed board in a space-saving manner. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
