| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method by which an electronic component package constituted by mounting an electronic component on a substrate is manufactured easily, inexpensively, and efficiently in an electrical reliability. <P>SOLUTION: The method of manufacturing the electronic component package includes: a component attaching step of attaching a plurality of electronic components 10 provided with bump electrodes 11 and 12 to an integral thermoplastic resin layer 13 so that the bump electrodes 11 and 12 may be embedded in the resin layer 13; a conductor forming step of forming conductors 15 and 16 conductively connected to the bump electrodes 11 and 12 on the surface of the resin layer 13 on the side opposite to the electronic components 10; and a component dividing step of forming electronic component packages 10P in which the electronic components 10 are respectively mounted on divided thermoplastic resin layers 13 by dividing the thermoplastic resin layer 13 into every electronic component 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
