| 摘要 |
PROBLEM TO BE SOLVED: To provide connection structure between a BGA type LSI with a connector for high-speed signals and a printed board in which destruction caused by thermal expansion can be prevented. SOLUTION: The connection structure is provided with pressurizing connection means 102, 110 for electrically connecting the BGA type LSI 300 with the connector to the printed board 500 so that the BGA type LSI 300 can be slightly moved in the longitudinal direction of a rigid cable 101 while pressurizing the BGA type LSI 300 to the printed board 500. When the BGA type LSI 300 is slightly moved on the printed board 500 due to thermal expansion/contraction of the rigid cable 101, slippage happens in a conductive film 110 and a conductive wire 201 in the conductive film 110 follows the slippage, so that the electrical connection between the BGA type LSI 300 and the printed board 500 can be maintained. COPYRIGHT: (C)2005,JPO&NCIPI
|
