| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic vessel for a tantalum electrolytic capacitor which can hold an airtightness of the tantalum electrolytic capacitor element even when the tantalum electrolytic capacitor is exposed to a high temperature when the tantalum electrolytic capacitor is soldered and which can be reduced in size, and to provide the tantalum electrolytic capacitor. SOLUTION: The ceramic vessel 6 includes a rectangular parallelepiped-like recess 3-B formed at a center of an upper surface, a first metallized layer 3a and a second metallized layer 3b formed on an inner surface of the recess 3-B, a first conductor layer 3c and a second conductor layer 3d formed on a lower surface, and a first connecting conductor 3e and a second connecting conductor 3f for connecting these layers. A protrusion 30 is formed on a front surface of the first metallized layer 3a. The protrusion 30 has a height of 0.02-0.1 mm, and a width of 0.1-0.5 mm viewed from above on a line for connecting the center of the protrusion 30 to the center of the recess 3-B. COPYRIGHT: (C)2005,JPO&NCIPI
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