COATING FILM FORMING APPARATUS AND COATING FILM FORMING METHOD

摘要

A coating liquid is applied to the surface of a substrate by generally-called scan coating. Adjacent coating liquid lines are joined infallibly. A wafer (W) is oriented for coating so that the scan direction of a coating liquid nozzle (5) may cross any of the dicing lines (D) drawn on the wafer (W). After the coating, the wafer (W) is returned to the initial orientation and then transferred out of the coating line forming apparatus. The coating film forming apparatus holds recipes defining the coating conditions for the respective types of the wafer (W). The coating conditions defined by the recipes include the orientation of the wafer (W). According to the selected recipe, the wafer (W) is automatically oriented.