STACKED PACKAGE AND METHOD FOR FORMING IT

摘要

A stacked package and a fabricating method thereof are provided to prevent an alignment error by inserting a plurality of uneven parts of a top package into a plurality of grooves of a bottom package. A bottom package(30) includes a first package body(35) having a first semiconductor chip(31) and a first lead(32b) connected to the first semiconductor chip through a first bonding wire(34). A top package(40) includes a second package body(45) having a second semiconductor chip(41) and a second lead(42b) connected to the second semiconductor chip through a second bonding wire(44). The bottom package further includes a plurality of first grooves(35a) formed in a first side of the first package body and a plurality of uneven parts formed in a second side corresponding to the first side. The top package further includes a plurality of second uneven parts(45b) formed in a first side of the second package body corresponding to the first grooves and a plurality of second grooves(45a) formed in a second side corresponding to the first side.