REINFORCED SOLDER BUMP AND METHOD OF FORMING REINFORCED SOLDER BUMP STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a reinforced solder bump structure that prevents mechanical stresses caused by a difference of coefficients of thermal expansion between components during working on a final device, a crack that may occur in the solder bump material owing to thermal circulation, and crack propagation, and also to provide a method of forming the reinforced solder bump structure.

SOLUTION: A method of manufacturing solder bumps comprises steps of: forming a first protrusion 311 extending upwardly from a contact pad 102 of a semiconductor chip 101; forming a second protrusion 312 extending upwardly from a ball pad of a mounting substrate 109; and forming the first protrusion 311 and second protrusion 312 within the solder material.

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