| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a bump structure that can form a bump structure whose installation position, shape, and size are excellently controlled. SOLUTION: The method for manufacturing the bump structure includes a process of forming an insulating convex part 10 on a base body 20 by ejecting a liquid insulating material 10b which sets when energy is imparted to the base body 20 and making the material set and a process of forming a conductive layer 30 on the concave part 10 by ejecting a liquid conductive material 30b which sets when energy is imparted and making the material set. COPYRIGHT: (C)2005,JPO&NCIPI
|
