| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a packaging structure of a semiconductor device in which a difference in a bonding strength between a conductive material and the semiconductor device and between the conductive material and a substrate can be reduced, and the bonding strength between the conductive material and the substrate can be increased. <P>SOLUTION: In the packaging structure of the semiconductor device, a plurality of electrode pads 5 are disposed on a substrate 1 in which a plurality of connection pads 3 are disposed to form a semiconductor device 4, which is arranged so that the connection pads 3 faces the electrode pads 5, and the both are connected to each other by a conductive material 6. Regarding the electrode pads 5 and the connection pads 3 which face each other, one pad area is made larger than the other, and also a size relation of both is alternately reversed along the arrangement of the pad. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
