| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency module which can suppress the heat generated by a power amplifier, can sufficiently radiate the heat, and can be reduced in height, and in which a passive component, such as the surface acoustic wave element etc., can be loaded together with the power amplifier; and to provide a communication terminal using the module. SOLUTION: The high-frequency module is constituted by mounting a power amplifying element 5 and the passive component 6 on the surface of a dielectric substrate 2 formed by laminating dielectric layers A upon another, and, at the same time, by providing heat sinks 9 in the dielectric substrate 2 immediately under the mounting section of the power amplifying element 5 through the substrate 2 from the front surface side to the rear surface side. The minimum diameters of the heatsinks 9 in their cross sections are adjusted to become three times or more larger than the thicknesses t of the dielectric layers A. It is particularly preferable that the dielectric substrate 2 is composed of the laminate of conjugated materials A formed by embedding at least conductor layers in dielectric layers having thicknesses t of≤0.1 mm in identical thicknesses, and the minimum diameters of the cross sections of the heatsinks 9 are≥0.3 mm. It is also preferable that the heatsinks 9 are composed of mixtures of conductor phases 11 and dielectric phases 10. COPYRIGHT: (C)2005,JPO&NCIPI |
