METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device by which the manufacturing cost of a semiconductor device is reduced by far improving utilizing efficiency of a use liquid material by using a simple process, and, at the same time, a metallic plug is formed surely in a contact hole. SOLUTION: The method of manufacturing the semiconductor device includes: a step ST1 of forming an insulating film having the contact hole on a first conductive film; a liquid repellent area forming step ST2 of forming a patterned liquid repellent film on the surface of the insulating film; and a liquid material arranging step ST3 of selectively arranging the liquid material in the contact hole. The method also includes a drying step ST4 of obtaining the metallic plug by solidifying the liquid material arranged in the contact hole by drying and baking the material, and a liquid repellent film removing step ST5 of removing the liquid repellent film. COPYRIGHT: (C)2005,JPO&NCIPI