发明名称 THIN FILM DEPOSITING METHOD, AND SUBSTRATE HOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thin film depositing method and a substrate holding device capable of uniformly heating a substrate and suppressing damages of a substrate surface. SOLUTION: The thin film depositing method for depositing a thin film on one main surfaces of a substrate 5 comprises a step of holding the substrate 5 with a predetermined space from a susceptor 1, and a film deposition step of depositing a thin film on one main surfaces of the substrate 5 with the substrate 5 heated via the susceptor 1. The substrate holding device 10 for heating and holding the substrate 5 comprises a heating body 2 to heat the substrate 5, the susceptor 1 disposed between the substrate 5 and the heating body 2, and a spacer 6 to hold the substrate 5 with a predetermined space from the susceptor 1. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005097710(A) 申请公布日期 2005.04.14
申请号 JP20030335835 申请日期 2003.09.26
申请人 SUMITOMO ELECTRIC IND LTD 发明人 FUJINO KOZO;DAIMATSU KAZUYA;KONISHI MASAYA;MOKURA SHIYUUJI
分类号 C23C14/28;C23C14/50;(IPC1-7):C23C14/50 主分类号 C23C14/28
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