发明名称 |
THIN FILM DEPOSITING METHOD, AND SUBSTRATE HOLDING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a thin film depositing method and a substrate holding device capable of uniformly heating a substrate and suppressing damages of a substrate surface. SOLUTION: The thin film depositing method for depositing a thin film on one main surfaces of a substrate 5 comprises a step of holding the substrate 5 with a predetermined space from a susceptor 1, and a film deposition step of depositing a thin film on one main surfaces of the substrate 5 with the substrate 5 heated via the susceptor 1. The substrate holding device 10 for heating and holding the substrate 5 comprises a heating body 2 to heat the substrate 5, the susceptor 1 disposed between the substrate 5 and the heating body 2, and a spacer 6 to hold the substrate 5 with a predetermined space from the susceptor 1. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005097710(A) |
申请公布日期 |
2005.04.14 |
申请号 |
JP20030335835 |
申请日期 |
2003.09.26 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
FUJINO KOZO;DAIMATSU KAZUYA;KONISHI MASAYA;MOKURA SHIYUUJI |
分类号 |
C23C14/28;C23C14/50;(IPC1-7):C23C14/50 |
主分类号 |
C23C14/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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