发明名称 CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition wherein an obtained cured article is excellent in heat resistance, flexibility, adhesiveness, etc. SOLUTION: The curable resin composition essentially comprises a cyanate resin and a terminal-epoxidation polyamaide resin composed of a polyamide resin represented by general formula (1) and epoxy groups bonded to the terminals thereof. The polyamide resin has a wt. average mol.wt. of 10,000-50,000 and a hydroxyl group equivalent of 350-1,500 g/eq. In general formula (1), R<SB>1</SB>, R<SB>2</SB>, R<SB>3</SB>, and R<SB>4</SB>are each a 1-20C aliphatic hydrocarbon or a benzene-ring-containing hydrocarbon; and m and n are each 1-100, provided n/(m+n) is 0.01-0.99. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005097469(A) 申请公布日期 2005.04.14
申请号 JP20030335052 申请日期 2003.09.26
申请人 MITSUBISHI GAS CHEM CO INC 发明人 IKEGUCHI NOBUYUKI;MISHIMA HIROYUKI;MORI KENICHI;MINE TAKAKIYO
分类号 C08L79/00;C08L77/06;(IPC1-7):C08L79/00 主分类号 C08L79/00
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