| 摘要 |
The invention relates to a moulding apparatus for moulding a chip on a flat carrier (4), comprising a mould formed by two mould parts (2,3) which are movable relative to each other and between which the carrier (4) can be received, the one mould part (3) of which is provided with a mould cavity against the peripheral edges of which the carrier (4) can be pressed, and means for exerting pressure in at least one cavity for moulding material arranged in the mould and connected to the mould cavity by means of a runner, wherein at least one compensation element (11) is arranged whereby in the closed position of the mould parts one side of the carrier (4) is held sealingly against the peripheral edge of the mould cavity. <IMAGE> |
