SUPPORTING TOOL FOR HEAT TREATMENT, HEAT TREATMENT APPARATUS, HEAT TREATMENT METHOD, METHOD OF MANUFACTURING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a supporting tool for heat treatment, a heat treatment apparatus, a heat treatment method, a method of manufacturing substrate, and a method of manufacturing semiconductor device for manufacturing high quality semiconductor device and substrate, by controlling the occurrence of slip dislocation fault of substrate caused during the heat treatment and the occurrence of damage at the rear surface of the substrate. SOLUTION: In the supporting tool for heat treatment 30 to support substrates 68, a supporting portion 58 which is in contact with the substrate 68 of the supporting tool 30 is formed of a partly cutout ring type member to support the part of 2/3 or more of the region at 5 mm or less from the edge of the substrate 68. COPYRIGHT: (C)2005,JPO&NCIPI