发明名称 LAMINATION CHIP FORMING MEMBER AND METHOD FOR MANUFACTURING LAMINATION CHIP ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a lamination chip forming member which is usable for a large current, and a method for manufacturing a lamination chip electronic part obtained by laminating the lamination chip forming members. SOLUTION: In the lamination chip forming members and the method for manufacturing the lamination chip electronic part obtained by laminating the lamination chip forming members, the method comprises the step of forming a second member having a second electric characteristic on the surface of a first member having a first electric characteristic, the step of forming a third member which has a third electric characteristic and is electrically connected to the second member on the upper face of the second member, the double layer step of coating a slurry-like material so as to cover the second member and the third member to form a fourth member having a fourth electric characteristic, the drying step of drying the fourth member, and the polishing step of polishing the fourth member so that an upper face of the third member and an upper face of the fourth member are extended flush with each other. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005101265(A) 申请公布日期 2005.04.14
申请号 JP20030333041 申请日期 2003.09.25
申请人 TDK CORP 发明人 MORIMOTO KEIICHI;KAWAKAMI YOSHIO;ENDO SEIICHI;SASAKI HIDEKI;NIITSUMA JINYO
分类号 H01F41/04;(IPC1-7):H01F41/04 主分类号 H01F41/04
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