摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board with higher accuracy, an etching apparatus, and an apparatus for manufacturing a wiring board. SOLUTION: The method for manufacturing the wiring board includes a process to form a wiring pattern 30 on a base substrate 10 comprising a metal layer 12 and a mask 14 formed on the metal layer 12 by being patterned by removing a part of the metal layer 12 by spraying an etchant 20. The process to spray the etchant 20 is performed while the base substrate 10 is carried to the diagonal upper direction. COPYRIGHT: (C)2005,JPO&NCIPI
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