| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing an epoxy resin molding material, wherein a kneaded ground product before compression molding is prevented from being agglomerated during storage to facilitate its feed and to thereby reduce tablets defective due to agglomerates and to reduce defects in electronic component devices sealed with the tablets. SOLUTION: The method for producing the sealing epoxy resin molding material comprises a step of kneading a raw material containing an epoxy resin, a curing agent, and a filler to obtain a kneaded mixture, a step of cooling the kneaded mixture to obtain a cooled product, a step of grinding the cooled product to obtain a kneaded ground product, a step of mixing the kneaded ground product with inorganic fine particles of a mean particle diameter of 50 nm or smaller to obtain a mixed product, and a step of compression-molding the mixed product. The step of adding the inorganic fine particles comprises at least one step selected from among the step (A) of adding the fine particles between the step of obtaining the kneaded ground product and the step of mixing, the step (B) of adding the fine particles between the step of obtaining the cooled product and the step of grinding, and the step (C) of adding the fine particles while grinding the cooled product. COPYRIGHT: (C)2005,JPO&NCIPI
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