发明名称 |
Substrate heater assembly |
摘要 |
A substrate heater assembly for supporting a substrate of a predetermined standardized diameter during processing is provided. In one embodiment, the substrate heater assembly includes a body having an upper surface, a lower surface and an embedded heating element. A substrate support surface is formed in the upper surface of the body and defines a portion of a substrate receiving pocket. An annular wall is oriented perpendicular to the upper surface and has a length of at least one half a thickness of the substrate. The wall bounds an outer perimeter of the substrate receiving pocket and has a diameter less than about 0.5 mm greater than the predetermined substrate diameter.
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申请公布号 |
US2005078953(A1) |
申请公布日期 |
2005.04.14 |
申请号 |
US20030684054 |
申请日期 |
2003.10.10 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
FODOR MARK A.;VELASTEGUI SOPHIA M.;SEN SOOVO;SIVARAMAKRISHNAN VISWESWAREN;LEE PETER WAI-MAN;SILVETTI MARIO DAVID |
分类号 |
C23C16/458;C23C16/46;H01L21/687;(IPC1-7):F26B3/30;F26B19/00;H01L21/20 |
主分类号 |
C23C16/458 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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