| 摘要 |
PROBLEM TO BE SOLVED: To provide a module component connection structure ensuring/controlling the packaging height of a module component. SOLUTION: In the module component connection structure, the module component 11 where at least one or more components 1, 2 are packaged on both the surfaces of a module substrate 10, is packaged onto a specified substrate 20 by a module component connection member 32 where both surfaces are connected each other. When the module component 11 is packaged onto the substrate 20, one surface of the module connection member 32 is connected to the one surface of the substrate 20, the other of the module connection member 32 is connected to one surface of the module component 11, and the components 1, 2 are inserted between the module component 11 and the substrate 20 for packaging. COPYRIGHT: (C)2005,JPO&NCIPI
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