| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-size ceramic circuit board provided with both ultrafine dimensionally precise wiring and high current-carrying circuit wiring, wherein a high-power semiconductor element is mounted and circuit layer wiring density is enhanced, and to provide a method for manufacturing the circuit board. SOLUTION: In the ceramic circuit board 1a wherein a circuit layer is integratedly bonded to at least one of surfaces of a ceramic board 2, the circuit layer is constituted of a first circuit layer 6 comprising a braze material and a second circuit layer 7 comprising a metal circuit board 4 bonded to the surface of the ceramic board 2 with the braze material between. COPYRIGHT: (C)2005,JPO&NCIPI
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