发明名称 |
COPPER FOIL WITH SILVER COATING LAYER AND COPPER CLAD LAMINATE USING IT |
摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil having not less than two copper foil layers and forming a copper foil layer of a copper clad laminate which uses a conductor comprising a conductive powder as a interlayer conducting means penetrating through an insulating base material part positioning between the copper foil layers, and to provide a copper clad laminate using the copper foil. SOLUTION: The copper foil with a silver coating layer comprises the silver coating layer at a sticking face with the insulating base material for composing the copper clad laminate of the silver foil is used. The interlayer conducting means formed on the insulating base material with the use of the copper foil with the silver coating layer uses the copper clad laminate as the conductor using the copper powder or the silver coated copper powder, or the mixed powder of the copper powder and the silver coated copper powder. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005101398(A) |
申请公布日期 |
2005.04.14 |
申请号 |
JP20030334699 |
申请日期 |
2003.09.26 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
SAKAGAMI TAKAHIKO;YOSHIMARU KATSUHIKO |
分类号 |
H05K1/09;B22F1/02;B32B15/01;B32B15/08;C22C5/06;H05K1/11;H05K3/38;(IPC1-7):H05K1/09 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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