| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus keeping the temperature uniformity of a substrate and never causing damages to pins and accumulation of gas. SOLUTION: A susceptor 73 installed on a heating plate 74 is divided into a movable section 73a and a fixed section 73b. A semiconductor wafer W carried in by a transfer arm TR is received by the lifted movable section 73a. After receiving the semiconductor wafer W, the movable section 73a is lowered to set in with the fixed section 73b, when top faces of the movable section 73a and the fixed section 73b become flush with each other, making the entire size of the susceptor 73 larger than the plane size of the semiconductor wafer W. Therefore, the entire semiconductor wafer W including ends thereof is uniformly heated. Since there is no delivery of wafers by means of rise and fall pins, there is no fear of damages to the rise and fall pins, and accumulation of gas in the pin holes which causes the pin holes to become a source of contamination. COPYRIGHT: (C)2005,JPO&NCIPI
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