DEVICE FOR TREATING SUBSTRATE BY PROCESSING LIQUID

摘要

PROBLEM TO BE SOLVED: To provide a treating device capable of reliably etching the periphery of a semiconductor wafer. SOLUTION: The treating device for treating the periphery of the semiconductor wafer by a processing liquid comprises a first driving means 1 for nearly horizontally retaining the semiconductor wafer for rotating and driving circumferentially; a rotating disk 11 that is formed so that the diameter of the rotating disk is slightly smaller than that of a semiconductor wafer, allows the rotation center to coincide with that of the semiconductor wafer, and alienates from the upper surface of the substrate at a specified interval, and is provided opposingly; a drive mechanism 12 for rotating and driving the rotating disk; and an upper nozzle body 13 that supplies a treatment liquid to the upper surface of the rotating disk that is rotated and driven for flowing from the periphery of the rotating disk to that of the semiconductor wafer. COPYRIGHT: (C)2005,JPO&NCIPI