| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC that is bonded to a packaging substrate with high mechanical strength, and sets the reinforcement bump for that purpose to the same size as a signal bump and the same layout configuration, in the IC in which the terminal is arranged in a grid array shape, and also to provide electronic equipment packaging the IC. <P>SOLUTION: Other pads excluding pads at the outermost periphery in a plurality of pads are set to be pads for signals to be connected to an internal circuit, and the pads at the outermost periphery are set to be pads for reinforcement connected to the pads for signals in proximity with the inner-periphery side. The pads for reinforcement and bumps provided at the pads for signals connected to them are collectively bonded onto a packaging substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
