| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing wiring, which dispenses with a photo-lithography process when connecting between patterns of an upper layer and lower layer, and a method for manufacturing a semiconductor device. SOLUTION: The method for manufacturing wiring includes a step of ejecting locally a composition containing a conductive material on a first pattern so as to form a conductor functioning as a pillar, a step of forming a dielectric so as to cover the conductor, a step of etching the dielectric so as to expose a part of the conductor, and a step of forming a second pattern on the exposed conductor. COPYRIGHT: (C)2005,JPO&NCIPI
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