| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for forming a solder bump capable of temporarily fixing a solder ball surely on an electrode for a substrate and capable of forming the solder bump having a high accuracy. <P>SOLUTION: The upper sections of the electrodes 2 for the substrate 1 are coated with fluxes 3, and a tool 4 with through-holes 5 is arranged on the substrate 1 while aligning the electrodes 2 for the substrate 1 and the through-holes 5. The upper section of the tool 4 is supplied with the solder balls 7, and the through-holes 5 of the tool 4 are filled with the solder balls 7. The solder balls 7 are pushed and pressed on the electrodes 2 for the substrate 1 by using a pressure member 8 heated at a temperature lower than the melting point of a solder after the through-holes 5 of the tool 4 are filled with the solder balls 7 while the fluxes 3 are heated to increase a viscosity, and the solder balls 7 are fixed temporarily on the electrodes 2 for the substrate. Since the solder balls 7 are temporarily fixed surely on the electrodes 2 in this manner, the positional displacements and falling-offs of the solder balls 7 can be prevented. The tool 4 is removed from the substrate 1, and the solder balls 7 are melted and the solder bumps 7a are formed. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
