| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To set a lamination height in laminating an assembly as low as possible, and to achieve the thinning of a circuit as a whole. <P>SOLUTION: Parts 4, 15 mounted to lead frames 2, 12 are laminated in an exposed state so as not to be covered with insulating resins 7, 18. For this reason, the lamination height of a power system assembly 8 or a control system assembly 16 is not influenced by thicknesses of the insulating resins 7, 18. A completed multilayer hybrid circuit can be reduced in thickness as much as possible. Further, the insulating resins 7, 18 support a power pattern or a fine pattern to prevent tottering, and also when the power pattern or the fine pattern is separated from fringes of the lead frames 2, 12, the island-like power pattern or the fine pattern can be prevented from coming off from a large current substrate 3 or a small current substrate 14. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
