WIRING BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a wiring board for realizing a low resistance of wiring resistance without imposing a high load on the environment and to provide a manufacturing method thereof. SOLUTION: A first conductor layer 16 containing first conductive particles 16A and a binding member 16B and a second conductor layer 18 containing second conductive particles 18A are vertically layered. The average particle diameter of the second conductive particles 18A is selected smaller than the average particle diameter of the first conductive particles 16A. Since no electric plating is employed, the resistance of the required wiring part can be decreased without imposing a large load on the environment. COPYRIGHT: (C)2005,JPO&NCIPI