| 发明名称 |
Pillar structures |
| 摘要 |
A die, comprising a substrate and one or more pillar structures formed over the substrate in a pattern and the method of forming the die.
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| 申请公布号 |
US2005077624(A1) |
申请公布日期 |
2005.04.14 |
| 申请号 |
US20030682054 |
申请日期 |
2003.10.09 |
| 申请人 |
ADVANPACK SOLUTIONS PTE. LTD. |
发明人 |
TAN KIM HWEE;SHEN CH'NG HAN;TAGAPULOT ROSEMARIE;BONG YIN YEN;HTOI MA L. NANG;SOON LIM TIONG;SHIKUI LIU;SIVAGNANAM BALASUBRAMANIAN |
| 分类号 |
H01L21/60;H01L23/485;(IPC1-7):H01L21/44;H01L23/52;H01L23/48;H01L29/40 |
主分类号 |
H01L21/60 |
| 代理机构 |
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