发明名称 MANUFACTURING METHOD OF ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component by which a ultrathin layer of a dielectric layer in electronic components such as, for example, a laminated ceramic capacitor is attained with less short fraction defective, and the electronic component obtained by the manufacturing method. SOLUTION: The manufacturing method is to manufacture the electronic component including at least a pair of internal electrode layers 14, 16 and the dielectric layer 10 formed between the internal electrode layers. Electrode films 12a, 14a which are to form the internal electrode layers after burning are formed, including a conductive composition and a dielectric composition. The electrode films 12a, 14a are laminated with a buffer layer 40 in between which does not include a main dielectric component of the dielectric composition. The electrode films 12a, 14a laminated with the buffer layer 40 in between are burned, then the dielectric composition included in the electrode films 12a, 14a is diffused between the electrode films 12a, 14a to form the dielectric layer 10 between the electrode films 12a, 14a. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005101547(A) 申请公布日期 2005.04.14
申请号 JP20040231443 申请日期 2004.08.06
申请人 TDK CORP 发明人 HIBI TAKAKO;SATO AKIRA
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/12
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