发明名称 MANUFACTURING METHOD OF LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated ceramic electronic component capable of accurate cutting. SOLUTION: The laminated ceramic electronic component is manufactured by a process of preparing a large-sized laminated sheet 10 for which a plurality of green sheets 2 divided into a plurality of substrate areas A arranged in a matrix shape and a frame-like margin area B surrounding the substrate areas A and provided with conductor patterns 3 and 4 on parts corresponding to the respective substrate areas A are laminated and belt-like division markers 5 and 6 composed of a conductor material of the same quality as the conductor patterns 3 and 4 are attached to the margin area B of the top layer at least of the green sheets 2 constituting the large-sized laminated sheet 10, a process of dividing a plurality of pieces 1 in one-to-one correspondence with the substrate areas A by cutting an insulation sheet 7 and the large-sized laminated sheet 10 with the attached position of the division markers 5 and 6 as a reference, and a process of obtaining the laminated ceramic electronic component by calcining the piece 1. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005101471(A) 申请公布日期 2005.04.14
申请号 JP20030335803 申请日期 2003.09.26
申请人 KYOCERA CORP 发明人 OTEGI SHINICHI
分类号 H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/30
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