发明名称 SPUTTERING TARGET AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To form a sputtering target of an Mo-W alloy system of higher density by sintering at a relatively low temperature and to attain further lower resistance of an alloy film deposited by using the same. SOLUTION: The sputtering target 2 is composed of an Mo-W-Al material having a composition containing Al ranging from 0.1 to 50mass% and the balance substantially a Mo-W alloy. The Mo-W alloy has the composition containing, for example, W ranging from 0.1 to 70mass% and the balance substantially Mo. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005097697(A) 申请公布日期 2005.04.14
申请号 JP20030334898 申请日期 2003.09.26
申请人 TOSHIBA CORP 发明人 WATANABE TAKASHI;KOMATSU TORU
分类号 B22F3/105;C22C1/04;C22C27/04;C23C14/34;(IPC1-7):C23C14/34 主分类号 B22F3/105
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