SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A SEMICONDUCTOR MODULE

摘要

The invention relates to a semiconductor module comprising a semiconductor device (10) provided with a contact device (11) for establishing an electrical contact with a connection device (17; 20) by means of a wiring device (15, 15', 15''), and a carrier device (12, 13, 14) for mechanically coupling the semiconductor device (10) to a connection device (17), the carrier device (12, 13, 14) being inclined between a first elasticity module on the semiconductor device (10) and a second, higher elasticity module on the connection device (17; 20). The invention also relates to a method for producing a semiconductor module.