| 摘要 |
A method of opening a wafer discrimination mark is provided to control accurately a boundary region between a field and a marking region of the wafer discrimination mark and restrain damage of an adjacent field by opening the wafer discrimination mark by an exposure process. A blank pattern(22) is inserted into a predetermined part of a reticle, which is used in an exposure process. A wafer discrimination mark is opened without damage of a field adjacent to a marking region(B) for marking the wafer discrimination mark by performing the exposure process using the reticle. The blank pattern is inserted into a reticle flame part corresponding to a flat zone of a wafer.
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