| 摘要 |
Components such as optical components are accurately aligned on a substrate by engagement with alignment features formed on the substrate. Substrate 1 is coated with a layer of SU-8 2000 (RTM) photoresist 26 by e.g. spin coating. The photoresist is then baked, a negative mask 28 is applied, and the photoresist is irradiated with UV light. The photoresist is then developed and unwanted portions are removed. The portions of photoresist remaining have sufficient size and strength to act as registration features for the alignment of circuit components on the substrate. The alignment structures are particularly useful for hybrid optical circuits. |
