METHOD AND APPARATUS FOR JOINING PROTECTIVE TAPE TO SEMICONDUCTOR WAFER

摘要

A method and an apparatus of joining a protective tape to a semiconductor wafer are provided to reduce particles generated from a cutting process of the protective tape by preventing friction between an unnecessary part of the protective tape and the protective tape to the semiconductor wafer. A holding member is used for holding a semiconductor wafer(2). An outer peripheral member is arranged nearly to the holding member. A protective tape joining unit(9) joints a protective tape(4) to a surface of the semiconductor wafer. A protective tape cutting unit cuts out the protective tape along an outer circumference of the semiconductor wafer. A separating unit separates an unnecessary part of the protective tape from the semiconductor wafer. The holding member and the outer peripheral member are arranged on a holding table(3) for holding the semiconductor wafer. The outer peripheral member is formed with different elements from elements of the holding table.