| 摘要 |
A modular socket is designed to facilitate the testing of an integrated circuit and is formed of a base unit 1, an interposer 2, a POGO pin unit 3, and an adapter unit 45. The base unit is provided with a plurality of contact terminals 122 which are electrically connected with the interposer. The interposer is provided with a plurality of pin holes for holding a plurality of elastic pins of the POGO pin unit such that one end of the elastic pins is extended into an integrated circuit seat of the adapter unit, thereby enabling the pins of the integrated circuit to be electrically connected with the contact terminals via the elastic pins in conjunction with the interposer. The socket may be used with 1C using ball grid array packaging . |
