Semiconductor device heat sink package and method

摘要

An electronic package (10) having enhanced heat dissipation is provided exhibiting dual conductive heat paths (40, 42) in opposing directions. The package (10) includes a substrate (18) and a semiconductor device (12) mounted to the substrate (18). The semiconductor device (12) has electrical circuitry a first surface, and a second surface oppositely disposed from the first surface. A thermally conductive heat sink (30) is assembled over the semiconductor device (12) such that a cavity (32) is formed between the semiconductor device (12) and the heat sink (30). A thermally conductive and electrically insulative material (36) is disposed in the cavity (32) between the semiconductor device (12) and the heat sink (30).